Shared foundry runs or Multi-Project Wafers are a cost effective foundry approach well suited for Institutes, Labs, Research Centers and Universities. This service allows different customer projects on a single wafer.
You will be able to:
Try new designs with high performance processes at limited cost
Design MMICs not available on the market place with perfect system fit & cost savings
Ensure business protection with secured IP & product exclusivity
Participants have free access to Design Kits. 20 diced & untested MMICs in Gel-Pak® box will eventually be delivered.
The possible die length and width, including dicing streets, are:
For high power processes PPH25X, PPH15X:
1.4mm
2mm
2.4mm
3.4mm
4mm
4.4mm
with maximum aspect ratio 1:3
For Low noise and multi-purpose processes PH25, PH15, PH10, PPH25, HB20M, HP07, BES
1mm
1.4mm
2.4mm
3.4mm
4mm
with maximum aspect ratio 1:3
For passive proces ULRC
1.4mm
2mm
2.4mm
3.4mm
Price is determined according to die area and process.
Next MPW runs
UMS shared foundry runs offer regular Multi Project Wafer runs with information 6 months notice before tape-out.
